Configured for discrete 24 VDC signal execution in TSX COMPACT backplane architectures, the Schneider Electric TSXDST1682 (TSXDST1682 Interface Output Module) provides direct electrical switching of field actuators through 16 output points with 0.5 A per channel drive capability.
SuffixBreakdown & Model Matrix
No validated manufacturer-published suffix segmentation or encoded option matrix is defined for TSXDST1682. The catalog number is treated as a single fixed ordering reference without documented modular decoding.
Hardware Specifications
| Parameter | Specification |
|---|---|
| ModelBrand | Schneider Electric TSXDST1682 |
| Origin | France (Schneider Electric product line) |
| Weight | 0.51 kg (1.13 lb) |
| Dimensions | Not specified |
| OperatingTemp | 0 degC to 60 degC |
| PowerConsumption | Not specified |
| Product Type | Interface Output Module |
| Platform | TSX COMPACT |
| Output Points | 16 |
| Output Voltage | 24 VDC |
| Output Current | 0.5 A per point |
| Signal Type | Digital output (24 V level) |
PLC Backplane Bus Communication and Output Switching Characteristics
Within Schneider Electric TSX COMPACT architectures, the TSXDST1682 interfaces to the rack backplane as a deterministic output expansion module. Output state updates are synchronized via internal bus cycle scanning, enabling aligned switching behavior across multiple I/O slots.
Electrical isolation between logic section and field output stage is implemented at module level to maintain separation between backplane communication voltage domains and external 24 VDC actuator circuits. Channel grouping supports direct wiring of solenoid valves, contactor coils, and CNC machine interface relays without external signal conditioning stages. Output saturation behavior is governed by internal transistor switching stages rated for repetitive 0.5 A DC load per channel.
Frequently Asked Questions (FAQ)
Q: Can the TSXDST1682 outputs be hot-swapped under load conditions?
A: Hot-swap is not supported for live field wiring. Module insertion/removal should only occur after backplane power is removed to prevent transient output states.
Q: What is the backplane load contribution of this module?
A: Backplane consumption is handled via TSX rack internal distribution; specific current draw is not published and depends on host rack configuration.
Q: Are outputs suitable for inductive loads such as relays or solenoids?
A: Yes, but external flyback suppression (diode or RC snubber) is required to limit voltage transients across switching transistors.
Field Installation Guidelines
The module shall be installed in a TSX COMPACT rack with secure backplane connector engagement to ensure stable signal alignment across I/O scan cycles. Field wiring must observe separation between 24 VDC output conductors and low-level signal cabling to minimize cross-coupling on adjacent channels.
Shielded cable grounding should be terminated at a single earth reference point to avoid ground loop circulation across multiple cabinet rails. Tightening torque for terminal connections should follow standard industrial control panel practice to maintain mechanical stability under vibration conditions typical of CNC machine environments.
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