The Schneider Electric TSXMRPC001M, also cataloged as the TSXMRPC SRAM memory module, operates as a dedicated hardware component for configurable application and file memory extension within TSX Micro PLC platforms.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Brand | Schneider Electric |
| Origin | France |
| Weight | 1.00 lbs (0.45 kg) |
| Dimensions | 2.5 cm x 5.8 cm x 7.6 cm |
| Operating Temp | 0 to 60 degC (32 to 140 degF) |
| Storage Temp | -25 to 70 degC (-13 to 158 degF) |
| Relative Humidity | 5 to 95% non-condensing |
| Power Consumption | Supplied via backplane bus |
| Memory Type | SRAM |
| Memory Capacity | 192 to 1024 kB application memory |
| Installation Slot | Slot 0 |
Backplane Bus Communication and Firmware Flash Compatibility
The module interfaces directly with the TSX Micro PLC processor via the proprietary backplane bus. Data transfer rates are governed by the specific CPU model in slot 1. Firmware flash compatibility must be verified between the installed CPU firmware version and the memory configuration utility. Incorrect firmware pairings may prevent the module from initializing the full 1024 kB allocation during cold start procedures.
Frequently Asked Questions
Q: Does the TSXMRPC001M support hot-swapping while the PLC is in RUN mode?
A: No. The module must be inserted or removed only when the TSX Micro base power supply is de-energized to prevent backplane bus corruption and data loss.
Q: What is the function of Slot 0 for this memory module?
A: Slot 0 is reserved exclusively for memory or system option modules. Installing the TSXMRPC001M in any other slot will result in a hardware configuration fault.
Q: Is battery backup required to retain data in the SRAM?
A: Yes. The SRAM is volatile and requires the presence of a functional lithium battery on the CPU or dedicated battery module to maintain application data during power-down events.
Field Installation Guidelines
Install the module into the leftmost Slot 0 of the TSX Micro rack. Ensure the DIN rail mounting clips are fully engaged before applying power. Verify that the memory capacity DIP switches (if present) match the software configuration prior to system startup. Do not exceed the specified torque values when securing the module’s upper fixing screw.
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