Overview
Configured for discrete output switching in VersaMax I/O systems, the GE Fanuc IC200MDL331 (IC200MDL331 Discrete Output Module) provides direct physical/electrical execution. This hardware component manages eight isolated output channels, delivering a nominal 120 VAC signal across an operating range of 85 to 132 VAC at 47 to 63 Hertz. Each point sustains an output current of up to 2.0 Amperes with a minimum threshold of 0.5 Amperes, while drawing a maximum of 85 mA from the backplane interface unit (BIU) power supply.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC200MDL331 |
| Brand | GE Fanuc |
| Origin | Standard Industrial Manufacturing |
| Weight | 1.13 lbs (0.51 kg) |
| Dimensions | Standard VersaMax DIN-rail form factor |
| Operating Temp | Industrial standard 0 deg C to 55 deg C |
| Power Consumption | 85 mA from BIU power supply (maximum) |
| Number of Outputs | 8 discrete channels |
| Output Voltage Range | 85 to 132 VAC |
| Nominal Voltage | 120 VAC |
| Output Current per Channel | 2.0 A max, 0.5 A min |
| Operating Frequency | 47 to 63 Hz |
| Inrush Current | 20 Amperes max |
| Output Grouping | Individually isolated |
Profinet / EtherNet/IP Deterministic Networks
The module interfaces with backplane bus communication architectures, facilitating deterministic data exchange across industrial automation networks. Because the unit relies on backplane power sourcing, system integrators must calculate the cumulative current draw of all connected I/O modules to prevent power supply overloads. Furthermore, the individually isolated output grouping ensures that electrical faults remain contained within specific channels, thereby protecting adjacent circuitry from transient voltage spikes and ground loops during active switching cycles.
Frequently Asked Questions
Q: Does the IC200MDL331 module support hot-swapping during normal system operation?
A: Hot-swapping VersaMax modules depends on the specific rack design and power configuration, but technicians generally power down the backplane bus before inserting or removing input/output hardware to prevent arcing and data corruption.
Q: How is the backplane power consumption calculated for this module?
A: The module draws a maximum of 85 mA directly from the BIU power supply, which must be factored into the total power budget of the rack assembly.
Field Installation Guidelines
Mount the IC200MDL331 module securely onto a standard DIN-rail within an appropriate industrial control enclosure. Ensure proper clearance above and below the module to facilitate adequate thermal dissipation. Connect field wiring to the terminal blocks while observing correct torque specifications, and apply appropriate shielding and grounding practices to minimize electromagnetic interference (EMI) across all AC output lines.
