Bachmann MPC265 Processor Module

Hardware Specifications

Industrial Control and Backplane Integration

The MPC265 combines processor execution with local communication and memory resources within the M1 controller architecture. Its Ethernet interfaces support 10/100 Mbps communication, while the serial interfaces provide RS232 and configurable RS232/422/485 connectivity.

The module also provides one CAN bus interface and one USB interface. Therefore, the controller can exchange data with multiple industrial devices through different physical interfaces.

For system expansion, the MPC265 supports PCC and CF card options. The integrated power supply can provide up to 17 W for additional I/O modules connected within the controller system.

The memory architecture separates volatile and non-volatile storage functions. Battery-backed SRAM supports retained working data, while 64 KB FRAM provides non-volatile data retention without battery dependence.

Frequently Asked Questions (FAQ)

Q: What communication interfaces are integrated into the MPC265?
A: The module provides 2 x 10/100 Mbps Ethernet ports, 1 x RS232 interface, 1 x RS232/422/485 interface, 1 x CAN bus interface, and 1 x USB port.

Q: Does the MPC265 provide non-volatile memory?
A: Yes. The module includes 64 KB FRAM, which retains stored data without requiring a battery.

Q: What temperature range is specified for the MPC265?
A: The supplied technical data specifies an operating range from -40 deg C to +70 deg C.

Field Installation Guidelines

• Install the MPC265 in the designated Bachmann M1 controller mounting position.
• Verify the controller backplane and module connections before applying power.
• Route Ethernet, CAN, serial, and power wiring separately where practical to reduce electrical interference.
• Use shielded communication cables where required by the connected interface and installation environment.
• Terminate cable shields according to the system grounding and EMC design requirements.
• Confirm that the connected I/O modules remain within the available 17 W supply capacity.
• Protect the module from conductive contamination, excessive vibration, and mechanical impact.
• Verify the installed memory and expansion configuration before commissioning application software.
• Check the battery-backed SRAM status when retained SRAM data is required.
• Do not install or remove expansion media while energized unless the specific system documentation explicitly permits hot-plug operation.