Bachmann MX220 Processor Module

Suffix Breakdown & Model Matrix

The MX200 series comprises scalable processing units designed for modular industrial applications. The hardware architecture scales across variants including the MX207, MX213, and the MX220, differing primarily in clock frequency, working memory allocation, and mass storage interfaces.

• MX207 / MX213 / MX220 Architecture: Based on the x86 / AMD LX low-voltage industrial processor core.
• Clock Frequency Scaling: Ranges from 266 MHz up to 433 MHz depending on the variant implementation.
• Storage Options: Supports integrated mass storage alongside removable Compact Flash via side cover and PC-Card interfaces on the front side.

Hardware Specifications

Industrial Communication & Backplane Architecture

The module interfaces directly with the Bachmann M200 backplane bus to deliver deterministic data exchange across distributed I/O nodes. Utilizing integrated Ethernet ports with AutoNegotiation and AutoCrossing capabilities, the system maintains stable communication topologies over TCP/IP and fieldbus protocols. Galvanically isolated CAN interfaces operating at up to 1 Mbit/s support CANopen and J1939 master or I/O device modes, ensuring robust performance in electromagnetic-heavy environments without data corruption.

Frequently Asked Questions

Q: Does the MX220 support hot-swapping of I/O modules on the M200 backplane?

A: System backplane design permits modular expansion, but power-down sequences or specific bus master configurations must be verified to prevent bus communication faults during module extraction.

Q: How is retentive data preserved during unexpected power loss?

A: Retentive data memory utilizes an onboard 512 kB NVRAM subsystem, ensuring non-volatile retention of critical process variables without relying on external battery maintenance.

Q: What programming environments are natively supported by the CPU runtime?

A: The processor supports IEC 61131-3 languages, C/C++, and MATLAB/Simulink target integration for execution under real-time multi-tasking task controls.

Field Installation Guidelines

1. Mount the MX220 module securely onto the Bachmann M200 backplane rail, ensuring physical latching mechanisms engage fully across both module widths.
2. Verify that ambient enclosure temperatures remain within the specified -30 deg C to +60 deg C operating envelope to ensure passive thermal dissipation without forced-air cooling.
3. Connect shielded communication cables (Ethernet RJ45 and D-sub serial/CAN interfaces) and ground cable shields directly to the designated industrial ground potential to maintain noise immunity.
4. Set the operational parameters using the dual 16-position hexadecimal rotary switches on the front panel before applying DC power to the integrated power supply unit.